1981 MicroComponent was established in with a workspace of 400 m2.
The company has developed into an independent company developing and manufacturing specific hybrid circuit applications in thick film or related technology for both the military and commercial markets.
1986 New facilities with 880 m workspace. Major contract with Tandberg Data.
1995 Major contract with Powec. Started manufacturing complete modules based on several other technologies other than ceramic substrate.
1998 Entered the EU market by cooperation with DA Elektronik in Gothenburg.
2001 New facilities with 3600 m2.
2003 Extended cooperation with Mectro.
2005 Erki Group established.
2009 Co-localisation with Mectro. Total facility area of 6200m2